This product is mainly designed to meet the multi-process integration requirements of 6/8-inch integrated circuits and compound semiconductors. It is a high-performance horizontal semiconductor thermal processing system. Featuring a modular design, the equipment is compatible with multiple processes such as oxidation, annealing, alloying, and LPCVD, and offers excellent temperature uniformity, process stability, and production efficiency. The system mainly consists of a process chamber, a transfer system, a gas distribution system, an exhaust gas treatment system, and a high-precision temperature control system. It can be flexibly configured according to customers’ different process and capacity requirements, providing a stable and reliable thermal processing platform for semiconductor manufacturing.
This product is mainly designed to meet the multi-process integration requirements of 6/8-inch integrated circuits and compound semiconductors. It is a high-performance horizontal semiconductor thermal processing system. Featuring a modular design, the equipment is compatible with multiple processes such as oxidation, annealing, alloying, and LPCVD, and offers excellent temperature uniformity, process stability, and production efficiency. The system mainly consists of a process chamber, a transfer system, a gas distribution system, an exhaust gas treatment system, and a high-precision temperature control system. It can be flexibly configured according to customers’ different process and capacity requirements, providing a stable and reliable thermal processing platform for semiconductor manufacturing.
产品特色
① 高产能设计： 采用高效卧式炉结构及优化的工艺流程设计，支持多片晶圆连续处理，有效提升设备产出效率，满足规模化生产需求。
② 优异的工艺稳定性： 通过精准的温度控制及稳定的气体输送系统，保障工艺过程的一致性与重复性，为产品良率提供可靠支撑。
③ 良好的可维护性： 采用模块化系统设计，关键部件布局合理，便于日常维护与检修，有助于提升设备长期运行效率。
④ 高效自动化运行： 配备完善的自动化控制系统，实现工艺参数精准控制及设备运行状态实时监测，提升生产过程的智能化水平。
Product Features
High-Throughput Design
An efficient horizontal furnace structure and optimized process flow design support continuous processing of multiple wafers, effectively improving equipment output and meeting the requirements of large-scale production.
Excellent Process Stability
Precise temperature control and a stable gas delivery system ensure process consistency and repeatability, providing reliable support for product yield.
Good Maintainability
The modular system design and rational layout of key components facilitate routine maintenance and servicing, helping to improve long-term equipment operating efficiency.
Efficient Automated Operation
A comprehensive automated control system enables precise control of process parameters and real-time monitoring of equipment operating status, enhancing the intelligence level of the production process.
Applicable Fields
MEMS (Micro-Electro-Mechanical Systems)
Advanced Packaging / Wafer-Level Packaging
Power Devices (IGBT / MOSFET / SiC / GaN)
Optoelectronic Chips / Optoelectronics and Image Sensors
