In March 2026, the 18th China International Advanced Ceramics Exhibition and SEMICON China 2026 were held successively in Shanghai. As a leader in industry collaborative innovation and system solutions, G&D Semiconductor showcased across the two exhibitions its profound expertise and latest breakthroughs in semiconductor and special materials-related manufacturing.
At the International Advanced Ceramics Exhibition, G&D Semiconductor highlighted its process capabilities for ceramic substrate sintering and related materials processing, further expanding the application scope of its equipment in the semiconductor materials field. At SEMICON China, a global platform, the company focused on showcasing equipment for integrated circuit and power semiconductor manufacturing, strengthening customers’ brand awareness of G&D Semiconductor in the field of core wafer fabrication equipment.
At the exhibition booths, G&D Semiconductor attracted numerous professional visitors with backgrounds in the semiconductor industry. The on-site team held in-depth exchanges with customers on key metrics such as high-temperature process stability, particle control capability, yield improvement, and equipment maintainability. In response to the pain points of ultra-high-temperature processes in SiC chip manufacturing, the company presented solutions in hardware, systems, and processes, receiving widespread attention and positive feedback.