Vertical Diffusion Furnace

FORTA Series BLD300/200/150

Vertical Diffusion Furnace

This product is mainly designed for the thermal processing requirements of 6/8-inch integrated circuits and compound semiconductors. It adopts a vertical furnace structure and features excellent temperature uniformity, process stability, and automated control capability. The system can be flexibly configured according to different process requirements and mainly consists of a process chamber, a loading system, a gas distribution system, an exhaust gas treatment system, and a high-precision temperature control system. It supports various thermal processes such as oxidation, annealing, and alloying, providing a stable and reliable process platform for semiconductor device manufacturing.

Wafer Size

6-inch / 8-inch

Applicable Materials

Applicable Processes

Oxidation, Annealing, Alloying, LPCVD

系统概述

产品特色

①　优异的温度均匀性与稳定性：采用优化的热场设计及高精度温控系统，实现炉内温度的精准控制，满足高一致性热处理工艺需求。
②　多工艺兼容能力：可支持氧化、退火、合金等多种工艺，并可根据不同产品及工艺需求进行灵活配置，提高设备适用性。
③　高自动化生产设计：配备自动化装载及控制系统，实现晶圆传输、工艺运行及设备状态监控的自动化，提升生产效率与稳定性。
④　良好的颗粒控制能力：通过优化腔体结构、气路设计及工艺流程，有效降低颗粒污染风险，满足半导体制造对洁净工艺环境的要求。
⑤　稳定高效的工艺性能：系统具备良好的工艺重复性及长期运行稳定性，可适应连续生产需求，提升产品良率与设备利用率。

Product Features

Excellent Temperature Uniformity and Stability

Optimized thermal field design and a high-precision temperature control system enable precise temperature control inside the furnace, meeting the requirements of high-consistency thermal processes.

Multi-Process Compatibility

Supports various processes such as oxidation, annealing, and alloying, and can be flexibly configured according to different product and process requirements, enhancing equipment applicability.

High-Automation Production Design

Equipped with automated loading and control systems, the equipment enables automated wafer transfer, process operation, and equipment status monitoring, improving production efficiency and stability.

Good Particle Control Capability

By optimizing the chamber structure, gas path design, and process flow, the risk of particle contamination is effectively reduced, meeting the cleanliness requirements of semiconductor manufacturing.

Stable and Efficient Process Performance

The system offers excellent process repeatability and long-term operational stability, adapting to continuous production requirements and improving product yield and equipment utilization.