info@gdsemisys.com

High-Temperature Annealing Furnace

FORTA 系列 HBA 200/150
FORTA 系列 HBA 200/150

FORTA Series HBA 200/150

High-Temperature Annealing Furnace

This product is mainly used for high-temperature annealing processes in 6/8-inch integrated circuits and compound semiconductors. It is a single-chamber high-temperature thermal processing system. The equipment features a high temperature ramp rate, excellent temperature control capability, and a high level of automation, meeting the requirements of high-temperature annealing processes for temperature uniformity, cleanliness, and process stability. The system mainly consists of a graphite chamber, an automated transfer system, a gas distribution system, an exhaust gas treatment system, and a high-precision temperature control system. It can perform high-temperature annealing processes under atmospheres such as Ar and H₂, providing stable and reliable thermal processing solutions for power device and compound semiconductor manufacturing.
Wafer Size
6-inch / 8-inch
Applicable Materials
SI / SIC
Applicable Processes
Inert Gas Annealing, Alloying
Contact Us

系统概述

This product is mainly used for high-temperature annealing processes in 6/8-inch integrated circuits and compound semiconductors. It is a single-chamber high-temperature thermal processing system. The equipment features a high temperature ramp rate, excellent temperature control capability, and a high level of automation, meeting the requirements of high-temperature annealing processes for temperature uniformity, cleanliness, and process stability. The system mainly consists of a graphite chamber, an automated transfer system, a gas distribution system, an exhaust gas treatment system, and a high-precision temperature control system. It can perform high-temperature annealing processes under atmospheres such as Ar and H₂, providing stable and reliable thermal processing solutions for power device and compound semiconductor manufacturing.

产品特色

①　高精度温度控制技术： 采用先进的温度控制方案及优化的热场设计，实现高温工艺过程的精准控制与良好稳定性，满足复杂退火工艺需求。

②　先进的颗粒控制技术： 通过优化腔体结构及工艺环境控制，有效降低工艺过程中的颗粒污染风险，提升产品良率及工艺一致性。

③　微环境氧含量精准控制： 具备先进的微环境氧含量控制能力，有效控制高温退火过程中的氧环境，为对工艺洁净度要求较高的应用提供保障。

④　高自动化与稳定运行： 配备自动化传输及控制系统，实现晶圆传输、工艺执行及设备状态监控的自动化，提高生产效率及设备运行稳定性。

⑤　高温工艺兼容能力： 支持Ar、H₂等不同工艺气氛下的高温退火，可满足不同材料及器件制造过程中的热处理需求。

Product Features

High-Precision Temperature Control Technology

Advanced temperature control schemes and optimized thermal field design enable precise control and excellent stability in high-temperature processes, meeting the requirements of complex annealing processes.

Advanced Particle Control Technology

By optimizing the chamber structure and process environment control, the risk of particle contamination during processing is effectively reduced, improving product yield and process consistency.

Precise Micro-Environment Oxygen Content Control

Advanced micro-environment oxygen content control capability effectively controls the oxygen environment during high-temperature annealing, providing assurance for applications with stringent process cleanliness requirements.

High Automation and Stable Operation

Equipped with automated transfer and control systems, the equipment enables automated wafer transfer, process execution, and equipment status monitoring, improving production efficiency and operational stability.

High-Temperature Process Compatibility

Supports high-temperature annealing under different process atmospheres such as Ar and H₂, meeting the thermal processing requirements in the manufacturing of various materials and devices.

Applicable Fields

Integrated Circuits (Ion Implantation Annealing)
化合物半导体功率器件（SiC MOSFET/SBD等）
Power Device Semiconductors (IGBT / MOSFET)
Advanced Packaging (Alloying)
R&D