From August 31 to September 2, the 14th Semiconductor Equipment, Materials and Core Components Exhibition (CSEAC 2026) was grandly held at the Wuxi Taihu International Expo Center. As a professional event in the semiconductor equipment field, this year’s exhibition covered an exhibition area of over 70,000 m² and brought together more than 1,300 exhibitors from home and abroad, spanning the entire industry chain from wafer fabrication and packaging and testing to core components.
G&D Semiconductor appeared at the exhibition as scheduled, bringing core products such as high-temperature furnace tubes and epitaxial growth equipment to engage in in-depth exchanges with industry partners and showcase the company’s technological achievements in semiconductor wafer thermal processing and epitaxial growth.
Since the opening of the exhibition, the G&D booth has attracted numerous professional visitors. Focusing on the application of high-temperature furnace tubes (oxidation/annealing) and epitaxial growth equipment in the manufacturing of silicon-based and SiC power devices, the technical team held in-depth discussions with customers from wafer fabs and IDM companies, achieving fruitful results.
Focusing on Third-Generation Semiconductors to Facilitate Industry Collaboration
As a company under LAPLACE specializing in thermal process equipment for third-generation semiconductors, G&D continues to deepen its work in SiC and silicon-based semiconductor process equipment, covering wafer fabrication and advanced packaging. During this exhibition, we also noted extensive industry discussions on advanced packaging, metrology and inspection, and other areas, which further strengthened our confidence in continuing to invest in R&D and improving our full range of thin-film equipment.